Laminate Types:
FR4, FR5, CEM3, GETEK, ROGERS, TACONIC, ARLON, FLEX CIRCUITS, CYANATE ESTER, POLYMIDE, BT, HITACHI MCL-BE67, HALOGEN FREE LAMINATES
Laminate Thickness:
.004" To .250"
Layer Count:
DOUBLE-SIDED
MULTI-LAYER, 4 through 16 layers
Panel Size:
Several Sizes up to 21" x 24"
Line Width and Spacing:
.004"/.004" Typical
Copper Weight:
1/2 oz. To 6 oz.
Finish Coatings:
- Hot Air Solder Leveling
- Organic Solderabilty Preservative (OSP)
- Electroless Nickel/Immersion Gold Finish (ENIG)
- Immersion Silver
-Tin
-Selective Gold
Soldermask:
Liquid Photoimageable
Final Fabrication:
Routed, Blanked, V-Scored & Jump Score
Electrical Test:
Circuit Line Universal Grid
Everett/Charles
Flying Probe
Other Attributes:
- Nickel/Gold Fingers
- Carbon Ink Keypads
- Via Plugging
-Via In Pad
-Micro Vias
-Blind Vias
-Buried Vias
-Controlled Impedance
-Aspect Ratio 10:1
-Pitch .015"
